Risk assessment: chip depackaging
Group/location:Security Group, Material Science preparation lab (New Museum Site) | |
Description of activity/workplace:Use of fuming nitric acid (HNO3, 98%) and acetone to remove plastic package from semiconductor chips. | Identified hazards:
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Whom those hazards affect:Sergei Skorobogatov (supervisor: Ross Anderson) | Reasonably foreseeable outcome:
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Safe working procedure:
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Assessment carried out by Markus Kuhn Date: 2003-09-22 |