Risk assessment: chip depackaging
Security Group, Material Science preparation lab (New Museum Site)
Description of activity/workplace:Use of fuming nitric acid (HNO3, 98%) and acetone to remove plastic package from semiconductor chips.
Whom those hazards affect:Sergei Skorobogatov (supervisor: Ross Anderson)
Reasonably foreseeable outcome:
Safe working procedure:
Assessment carried out by Markus Kuhn